采用镶嵌靶、通过直流磁控溅射法在不加热的情况下于硅基片上制备了Ti-49.57%Ni-5.6%Cu合金薄膜.XRD图谱表明,该薄膜为非晶态.对其进行的退火晶化后的形状记忆性能研究发现:薄膜分别经550℃×0.5 h、650℃×0.5 h晶化处理后无残余塑变存在下的最大恢复应力、最大恢复应变分别为180 MPa、2.7%;90 MPa、1.4%.
参考文献
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