研究了电流密度、镀液温度及镀层厚度对磷青铜上钯镀层的焊锡性与润湿平衡的影响.钯镀层的晶粒尺寸随电流密度的增加或温度的升高而变大,但受膜厚的影响不大.镀态下,不同条件下制得的钯镀层具有良好的沾锡能力.不同活性助焊剂的使用也会影响钯镀层的焊锡性能.对于经蒸汽老化后的钯镀层,采用中等活性的松香助焊剂可获得比采用非活性松香助焊剂更好的焊锡性能.
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