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研究了气体雾化高硅铝合金粉末的中值直径d50与硅粒子尺寸的关系,并用传热学分析了这一现象.结果表明,粉末中值直径d50与硅粒子细化有密切的关系,存在一定的规律,并认为当d50<50μm时,硅粒子尺寸<3μm.

参考文献

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