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研究了纳米晶CuCr25和CuCr50触头材料在峰值电流为10 A时,真空电弧的截流值、稳定性及其寿命.结果表明,纳米晶CuCr合金的真空电弧稳定性要高于其常规合金,纳米晶CuCr合金截流值远小于常规合金的截流值.从理论分析可得出,纳米晶CuCr合金的蒸汽压为其常规合金蒸汽压的10倍多.由于蒸汽压与电弧放电特性密切相关,所以CuCr触头材料纳米晶化可以有效地增加电弧稳定性和降低材料的截流值.

参考文献

[1] Yamamoto A.;Okutomi T. .Instability of vacuum arc in Ag-Cu contact alloys[J].IEEE Transactions on Plasma Science,1993(5):463-468.
[2] Rieder W.F.;Schussek M. .The influence of composition and Cr particle size of Cu/Cr contacts on chopping current, contact resistance, and breakdown voltage in vacuum interrupters[J].IEEE transactions on components, hybrids, and manufacturing technology,1989(2):273-283.
[3] Slade P.G. .Advances in material development for high power, vacuum interrupter contacts[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1994(1):96-106.
[4] Smeets R.P.P. .The origin of current chopping in vacuum arcs[J].IEEE Transactions on Plasma Science,1989(2):303-310.
[5] ZHAO Feng,XU Hui,YANG Zhi-mao,DING Bing-jun.Preparation of CuCr25 alloys through vacuum arc-smelting and their properties[J].中国有色金属学会会刊,2000(01):73.
[6] Ding B J;Yang Z M;Wang X .Influence of microstructure on dielectric strength of CuCr contacts in a vacuum[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1996,19(01):76-81.
[7] 王江,张程煜,丁秉钧.加入Ni-Al,W-Ni,W-Co二元添加剂时的CuCr25合金的组织与性能[J].稀有金属材料与工程,2001(04):290-294.
[8] 石霖.合金热力学[M].北京:机械工业出版社,1992:417-464.
[9] 韩德刚;高执棣;高盘良.物理化学[M].北京:高等教育出版社,2001:684-685.
[10] 程传煊.表面物理化学[M].北京:科学技术文献出版社,1995:12-72.
[11] 武建文,王毅,王季梅.真空电弧电子扩散过程及电弧半径的研究[J].高压电器,1997(03):8.
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