随着大功率模块与电力电子器件的发展,陶瓷表面金属化已得到广泛应用.直接敷铝技术是基于氧化铝陶瓷基板发展起来的一种陶瓷表面金属化技术.在介绍直接敷铝基板的制备方法和性能特点的基础上,重点讨论影响Al-Al_2O_3润湿性能的因素以及这些因素对氧化铝陶瓷基板敷铝过程的影响,同时展望了DAB基板在功率电子系统、汽车工业等方面的应用前景.
With the development of power electronic modules, metalizing of ceramics has been developed and used in many industrial area. Direct aluminum bonded (DAB) substrates are developed on Al_2O_3 ceramic metallization. This paper briefly introduces the fabricating process and properties of DAB substrates, and focuses on the factors affecting the wettability of Al/ Al_2O_3 system and its influence on the bonding process of DAB substrates. Meanwhile, the potential applications of DAB substrates in power-electronics, automotive industry are forecasted in this paper.
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