采用Ti/Cu/Ti复合中间层实现Al2O3-TiC陶瓷基复合材料和Cr18-Ni8不锈钢的扩散焊接.采用光学显微镜(OM)、电子探针(EPMA)、X-射线衍射(XRD)等分析手段,对Al2O3-TiC/Cr18-Ni8扩散焊接头的显微组织、元素分布及析出相进行分析.结果表明:Al2O3-TiC/Cr18-Ni8界面结合紧密,界面过渡区与两侧基体间界面平直.Ti与Al2O3间的反应主要发生在陶瓷表面附近;在Cu层内,Ti和Cu浓度轮廓互补;Ti向不锈钢侧扩散较大的距离,Fe、Cr表现为相似的扩散趋势:Ni呈现"上坡"扩散的特点.Al2O3-TiC/Cr18-Ni8接头的界面结构为Al2O3+TiC,NiAl204,TiC,CuTi+Cu(Ni),FeTi+Cr2Ti+TiC和Fe.
参考文献
| [1] | 宋世学,艾兴,赵军,吴齐.Al2O3/TiC纳米复合刀具材料的力学性能与增韧强化机理[J].机械工程材料,2003(12):35-37,41. |
| [2] | 赵康;陈宇航;鄢君辉 等.Al2O3/TiC复合陶瓷热震压痕裂纹扩展规律[J].中国有色金属学报,1998,8(z2):46-48. |
| [3] | J.J. STEPHENS;F.M. HOSKING;T.J. HEADLEY .Reaction Layers and Mechanisms for a Ti-Activated Braze on Sapphire[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2003(12):2963-2972. |
| [4] | Mandal S;Rao V;Ray A K .Characterization of the brazed joint interface between Al2O3 and(Ag-Cu-Ti)[J].Journal of Materials Science,2004,39:5587-5590. |
| [5] | 于治水,吴铭方,祁凯,王凤江.Al2O3/（Ag72Cu28）97Ti3/Ti-6Al-4V界面反应[J].机械工程学报,2002(02):31-34. |
| [6] | Kelkar G P;Spear K E;Carim A H .Thermodynamic evaluation of reaction products and layering in brazed alumina joints[J].Journal of Materials Research,1994,9(09):2244-2250. |
| [7] | Kim JJ.;Park JW.;Eagar TW. .Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):240-244. |
| [8] | Chen Z;Cao MS;Zhao QZ;Zou JS .Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2004(1/2):394-401. |
| [9] | 邹贵生,吴爱萍,任家烈,任维佳,李盛.Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷结合机理[J].清华大学学报(自然科学版),2001(4-5):51-54. |
| [10] | 曲文卿,庄鸿寿,张彦华.异种材料TLP扩散连接过程的非对称性[J].中国有色金属学报,2003(02):300-304. |
| [11] | 王娟,李亚江,S.A.GERASIMOV.Al2O3-TiC/Q235真空扩散钎焊界面组织及抗剪强度[J].焊接学报,2008(12):25-28. |
| [12] | 王娟,李亚江,马海军,刘鹏.Ti/Cu/Ti复合中间层扩散连接TiC-Al2O3/W18Cr4V接头组织分析[J].焊接学报,2006(09):9-12. |
| [13] | Chidambaram P R;Edwards G R;Olson D L .Kinetics of interlayer formation on polycrystalline α-Al2O3/copper-titanium alloy interface[J].Metallurgical and Materials Transactions,1994,25A(10):2083-2090. |
| [14] | Iijimal Y;Hoshino K;Hirano K I .Diffusion of titanium in copper[J].Metallurgical and Materials Transactions,1977,8A(06):997-1001. |
| [15] | A. Elrefaey;W. Tillmann .Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer[J].Journal of Materials Processing Technology,2009(5):2746-2752. |
| [16] | 张荣禄;李慕勤;张九海 等.中间过渡金属对钛合金与不锈钢扩散焊接头强度的影响[J].焊接学报,1996,17(04):212-218. |
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