流延坯片的叠层是多层陶瓷技术中最为重要的工艺之一.叠层工艺直接影响到电子器件三维结构(如通道、腔室及隔膜等)的质量.对叠层工艺如热压法叠层及其改进型技术、粘合基叠层、溶剂基叠层等进行综述,并对各种叠层方法的特点、研究进展及应用进行叙述.
参考文献
| [1] | Gongora-Rubio M;Solá-Laguba L M;Moffett P J et al.The utilisation of low temperature co-fired ceraric(LTCC-ML)technology for meso-scale EMS,a simple thermistor based flow sensot[J].Sensors and Actuators A:Physical,1999,73(03):215-221. |
| [2] | LJ.GOLONKA .Technology and applications of Low Temperature Cofired Ceramic(LTCC)based sensors and microsystems[J].Bulletin of the Polish Academy of Sciences. Technical Sciences,2006(2):221-231. |
| [3] | Jurk6w D;Golonka L J;Roguszczak H.LTCC gas flow detector[A].Finland:Oulu,2007:204-207. |
| [4] | Torsten Thelemann;Heiko Thust;Michael Hintz .Using LTCC for microsystems[J].Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe,2002(3):19-23. |
| [5] | Kita J;Dziedzic A;Golonka L J et al.Laser treatment of LTCC for 3D structures and elements[J].Microelectronics International,2002,19(03):14-18(5). |
| [6] | Bembnowicz P;Golonka L J.Ceramic microreactor with integrated heater and temperature sensor[A].RzeszōwKrasiczyn,2007:429-432. |
| [7] | Mistler R E;Twiname E R.Tape casting theory and practice[M].Westerville:The American Ceramic Society,2000:205. |
| [8] | Hellebrand H;Tape Casting.In materials science and technology[A].VCH Verlagsgescllschaft,Germany:Weinheim,1996:189-265. |
| [9] | Schwartz B;Wilcox D L .Laminated ceramics[J].CERAMIC AGE,1967,83(06):40-44. |
| [10] | Mistler R E .Tape casting:the basic process for meeting the needs of the electronics industry[J].American Ceramic Society Bulletin,1990,69:1022-1026. |
| [11] | Reed J S.Principles of ceramic processing[M].John Willey& Sons,New York,1994:537. |
| [12] | Chartier T;Rouxel T .Tape-cast alumina-zirconia laminates:processing and mechanical properties[J].Journal of the European Ceramic Society,1997,17:299-308. |
| [13] | 刘庆,覃剑,陈禧,夏风,肖建中.多层流延生坯的热压法叠层工艺研究[J].硅酸盐通报,2011(01):34-38. |
| [14] | Dominik Jurkow;Leszek Golonka .Low-pressure, thermo-compressive lamination[J].Journal of the European Ceramic Society,2012(10):2431-2441. |
| [15] | Suhas K .Materials and processes in 3D structuration of low temperature cofired ceramics for meso-scale devices[J].Industrial Ceramics,2009,29(03):1-8. |
| [16] | Birol H;Maeder T;Ryser P .Processing of graphite-based sacrificial layer for microfabrication of low temperature co-fired ceramics (LTCC)[J].Sensors and Actuators, A. Physical,2006(0):560-567. |
| [17] | Birol H;Maeder T;Jacq C.Structuration of microfluidic devices based on low temperature Co-fired ceramic(LTCC)technology[A].Belgium:Brugge |
| [18] | L.E. Khoong;Y.M. Tan;Y.C. Lam .Overview on fabrication of three-dimensional structures in multi-layer ceramic substrate[J].Journal of the European Ceramic Society,2010(10):1973-1987. |
| [19] | Roosen A .New lamination technique to join ceramic green tapes for the nanufacturing of multilayer devices[J].Journal of the European Ceramic Society,2001,21:1993-1996. |
| [20] | M.A.Piwonski and A.Roosen .Low pressure lamination of ceramic green tapes by gluing at room temperature[J].Journal of the European Ceramic Society,1999(2):263-270. |
| [21] | Roosen A;Schindler K.Cold low pressure lamination of ceramic green tapes[A].Baltimore,2005 |
| [22] | Rocha Z M;Ibaflez Garcia N;Oliveira N A.Low temperature and pressure lamination of LTCC tapes for meso-systems[A].Denver,Colorado,2004 |
| [23] | Jurkow Dominik;Golonka Leszek .Cold Chemical Lamination—New Bonding Technique of LTCC Green Tapes[J].International journal of applied ceramic technology,2010(6):814-820. |
| [24] | J. Gurauskis;A.J. Sanchez-Herencia;C. Baudin .Alumina-zirconia layered ceramics fabricated by stacking water processed green ceramic tapes[J].Journal of the European Ceramic Society,2007(2/3):1389-1394. |
| [25] | Gurauskis J;Sanchez-Herencia A J;Baudin C .Joining green ceramic tapes made from water-based slurries by applying low pressures at ambient temperature[J].Journal of the European Ceramic Society,2005,25:3402-3411. |
| [26] | A. J. Sanchez-Herencia;J. Gurauskis;C. Baudin .Processing of Al_2O_3/Y-TZP laminates from water-based cast tapes[J].Composites, Part B. Engineering,2006(6):499-508. |
| [27] | J. Gurauskis;A. J. Sanchez-Herencia;C. Baudin .Laminated Ceramic Structures within Alumina / YTZP System Obtained by Low Pressure Joining[J].Key engineering materials,2007(333):219-222. |
| [28] | Nitinat Suppakarn;Hatsuo Ishida;James D.Cawley .Roles of Poly(propylene glycol) during Solvent-Based Lamination of Ceramic Green Tapes[J].Journal of the American Ceramic Society,2001(2):289-294. |
| [29] | Jurków D;Rogaszczak H;Golonka L J .Cold chemical lamination of ceraraic green tapes[J].Journal of the European Ceramic Society,2009,29:703-709. |
| [30] | Xuechuan Shan;H. P. Maw;C. W. Lu .Solvent-assisted low pressure room temperature lamination of low temperature cofirable ceramic green tapes for formation of embedded micro channels[J].Microsystem technologies,2010(8/9):1501-1506. |
| [31] | 康连生,马增刚,贾霞彦,陈军.LTCC叠片工艺技术研究[J].电子工业专用设备,2010(05):42-45. |
| [32] | M. R. Gongora-Rubio;P. Espinoza-Vallejos;L. Sola-Laguna;J. J. Santiago-Avilés .Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST)[J].Sensors and Actuators, A. Physical,2001(3):222-241. |
| [33] | Yoshihiko Imanaka.Multilayered low temperature cofired ceramics(LTCC)technology[M].Springer Science + Business Media,Inc,2005:154-156. |
| [34] | 崔学民 .乳胶体系水基流延工艺及其叠层制备陶瓷材料的研究[D].中国建筑材料科学研究院,2003. |
| [35] | Griffin C W;Danfenbach J;McMillin S et al.Desktop Manufacturing:LOM vs pressing[J].American Ceramic Society Bulletin,1994,73(08):109-113. |
| [36] | Cui Xuemin;Ouyang Shixi;Yu Zhiyong et al.A study on green tapes for LOM with water-based tape casting processing[J].Materials Letters,2003,57(07):1300-1304. |
| [37] | Karin Schindler;Andreas Roosen .Manufacture of 3D structures by cold low pressure lamination of ceramic green tapes[J].Journal of the European Ceramic Society,2009(5):899-904. |
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