采用化学镀方法在超声波辐照下对10～20 nm的Al2O3粉末进行化学镀铜,并探讨了镀液组成及工艺条件对纳米Al2O3粉末化学镀铜的影响,利用X射线衍射判断其成分组成,用TEM观察镀覆结果.结果表明:引入超声波并调整镀液组成和工艺条件可以实现室温的纳米Al2O3粉末化学镀铜,使化学镀铜在低温下 保持了镀液的稳定性,同时对纳米粉末进行有效的分散;以EDTA-2Na为络合剂,并加入亚铁氰化钾和2-2联吡碇作为稳定剂,可以有效地消除或减少复合粉末中的Cu2O.通过改变低温超声波化学镀铜时的镀液组成和装载量,可以一次镀覆得到铜含量为5%～90%的Cu-Al2O3复合粉末.
参考文献
| [1] | Lin W H .The effect of palladium on copper dispersion and ethanol dehydrogenation activity of Cu/Al2O3 cata lysts prepared by the electroless plating procedure[J].Journal of the Chinese Institute of Chemical Engineers,1999,30(01):51-57. |
| [2] | Chi K;HU Z L;Yu C Z et al.Electroless copper coating for hydrogen storage alloy powders[J].Battery,1995(25):224-227. |
| [3] | Chang S Y;LIN S J .Fabrication of SiC//w reinforced copper matrix composite by electroless copper plating[J].Scripta Materialia,1996,35(02):225-231. |
| [4] | 刘伯威,张金生,FAN Yi,樊毅,吴芳,高游.非金属颗粒镀铜及对烧结摩擦材料强度的影响[J].材料保护,2001(02):23-24. |
| [5] | Naser J;RIEHEMANN W;Ferkel H.Dispersion hardening of metals by nanoscaled ceramic powders[J].Materials Science and Engineering,1997:467-469. |
| [6] | 李玉桐;董治中 .纳米Al2O3增强铜基复合材料的组织及性能[J].天津大学学报,1996,29(01):123-129. |
| [7] | Sung-Tag Oh;Jai-Sung Lee;Tohru Sekino .FABRICATION OF Cu DISPERSED Al_2O_3 NANOCOMPOSITES USING Al_2O_3/CuO AND Al_2O_3/Cu-NITRATE MIXTURES[J].Scripta materialia,2001(8-9):2117-2120. |
| [8] | Ang LM.;Xu GQ.;Tung CH.;Zhao SP.;Wang JLS.;Hor TSA. .Decoration of activated carbon nanotubes with copper and nickel[J].Carbon: An International Journal Sponsored by the American Carbon Society,2000(3):363-372. |
| [9] | LING Guo-ping;LI Jian;WANG Shang-jun .PREPARATION AND CHARACTERISTICS OF NEW TYPE NANOCOMPOSITE POWDER[J].Journal of Zhejiang University Science,2001(4):376-378. |
| [10] | GARG A K;DE JONGHE L C .Metal-coated colloidal particles[J].Journal of Materials Science,1993,28:3427-3432. |
| [11] | 伍学高;李铭华;黄渭成.化学镀技术[M].成都:四川科学技术出版社,1985 |
| [12] | F. Touyeras;J. -Y. Hihn;M. -L. Doche;X. Roizard .Electroless copper coating of epoxide plates in an ultrasonic field[J].Ultrasonics sonochemistry,2001(3):285-290. |
| [13] | HAYAKAWA O;NAKAHIRA K;NAITO M et al.Experimental analysis of sample preparation conditions for particle size measurement[J].Powder Technology,1998,100:61-68. |
| [14] | Bindra P;ROLDAN J M;ARBACH G V .Mecha nisms of electroless metal plating: II. decomposition of formaldehyde[J].IBM JOURNAL OF RESEARCH AND DEVELOPMENT,1984,28:679-683. |
| [15] | Shachamdiamand Y.;Angyal M.;Dubin V. .ELECTROLESS COPPER DEPOSITION FOR ULSI[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1995(1/2):93-103. |
| [16] | JUNGINGER R .Nodule formation in electroless copper baths[J].Journal of the Electrochemical Society,1988,135:2299-2302. |
| [17] | J.Shu;B.P.A.Grandjean;S.Kaliaguine .Effect of cu(OH)_2 on electroless copper plating[J].Industrial & Engineering Chemistry Research,1997(5):1632-1636. |
| [18] | Matsuoka M.;Iwakura C.;Yoshida Y. .THE EFFECTS OF AERATION AND ACCUMULATION OF CARBONATE IONS ON THE MECHANICAL PROPERTIES OF ELECTROLESS COPPER COATINGS[J].Journal of the Electrochemical Society,1995(1):87-91. |
| [19] | 张道礼,龚树萍,周东祥.化学镀铜液中铜离子型体分布和络合剂的作用[J].材料保护,2000(04):3-4. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%