通过一定范围内的强度实验数据建立了Al2O3/Cu/Al扩散连接工艺规范参数优化的数学模型,得到了评价接头综合性能的回归方程.利用该方程求得最佳接头性能的工艺参数为:T=777 K、t=122 6 s.对该工艺规范扩散连接的Al2O3/Cu/Al接头进行强度试验,接头抗拉强度为108 MPa、剪切强度为45 MPa.强度试验结果表明,接头获得最佳综合强度值的工艺规范介于获得最大抗拉强度值时的规范与获得最大剪切值时的规范之间.在最佳综合规范下,接头的抗拉强度和剪切强度值与最大抗拉强度、最大剪切强度值接近,这表明数学模型所计算出来的最佳规范与实际值吻合较好.
参考文献
| [1] | KLIAUGA A M;Travessa D;Ferrante M .Al2O3/Ti interlayer/AlSi304 diffusion bonded joint microstructural characterization of the two interfaces[J].Materials Characterization,2001,46:65-74. |
| [2] | Rijnders M R;Peters S D .Joining of alumina using a V-active filler meteal[J].Scripta Materialia,1999,41(10):1137-1146. |
| [3] | R.A.MARKS;D.R.CHAPMAN .JOINING OF ALUMINA VIA COPPER/NIOBIUM/COPPER INTERLAYERS[J].Acta materialia,2000(18/19):4425-4438. |
| [4] | Zhu Dingyi;Ma Mingliang;Jin Zhihao;Wang Yonglan .The effect of molybdenum net interlayer on thermal shock resistance of Al{sub}2O{sub}3/Nb brazed joint[J].Journal of Materials Processing Technology,1999(1/3):19-21. |
| [5] | Frank Essl;Jorn Bruhn;Rolf Janssen et al.Wet milling of Al-containing power mixtures as precursor materials for reaction bonding of alumina(RBAO) and reaction sintering of alumina-aluminide alloys[J].Materials Chemistry and Physics,1999(61):69-77. |
| [6] | Curicuta V;Alecander D R;Liu Y et al.Furnance and laser methods of bonding metals to ceramics:interface investigation[J].Materials Science and Engineering,2000,B68:196-203. |
| [7] | Wang Dayong;Fang Jicai;Liu Huijie.Diffusion bonding of Al2O3 ceramic to Al alloy[A].Yang Zhong China,2001:166-170. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%