欢迎登录材料期刊网

材料期刊网

高级检索

首次采用无压浸渗工艺,使Al液自发浸渗进入多孔Si预制件中,制备出Al/70vol%SiP复合材料,对该材料的浸渗过程、组织特点和热物理性能进行了分析.研究发现,与其他方法相比,无压浸渗料获得的高含量Sip/Al复合材料,在性能上具有低密度、高导热率、低膨胀系数等特点,具备了热控制材料的基本特征,明显优于Cu-W、Fe-Ni合金、Kovar合金、SiCp/al复合材料,以及采用其他工艺制备的Si/Al复合材料.

参考文献

[1] GLATZ J;VRABLE D L .Applications of advanced composites for satellite packaging for improved electronic component thermal management[J].Acta Astronautica,1993,29(07):527-535.
[2] 过增元,梁新刚,张信荣.空间站热管理[J].科学通报,2001(16):1403-1408.
[3] NOVICH;ADAMS R W.Aluminum/Silicon carbide (AlSiC) metal matrix composites for advanced packaging applications[A].San Diego:CA,1995:220-227.
[4] HAQUE S;XING K;SUCHICITAL C.Thermal management of high-power electronics modules packaged with interconnected parallel plates[A].San Diego:CA,1998:111-119.
[5] MOORES K A;JOSHI Y K.High performance packaging materials and architectures for improved thermal management of power electronics[J].Future Circuits International,2001(07):45-49.
[6] LOSTETTER A;BARLOW F;ELSHABINI A .Thermal evaluation and comparison study of power base plate materials[J].Advancing Microelectronics,1998,25(01):25-27.
[7] M.I. Pech-Canul;M.M. Makhlouf .Processing of Al-SiC_p Metal Matrix Composites by Pressureless Infiltration of SiC_p Preforms[J].Journal of Materials Synthesis and Processing,2000(1):35-54.
[8] Jacobson D.M.;Sangha P.S. .A novel lightweight microwave packaging technology[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1998(3):515-520.
[9] C.W. Chien;S.L. Lee;J.C. Lin .Effects of Si_p size and volume fraction on properties of Al/Si_p composites[J].Materials Letters,2002(4/5):334-341.
[10] 胡德林.金属学原理[M].西安:西北工业大学出版社,1995
[11] C. Bocking;D. M. Jacobson;A. E. W. Rennie .Rapid production of microwave packaging in silicon-aluminium by thin-shell electroforming[J].Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe,2002(1):30-32.
[12] 果世驹.粉末烧结理论[M].北京:冶金工业出版社,1998
[13] 田莳.材料物理性能[M].北京:北京航空航天大学出版社,2001
[14] FIEGL B;KUHNERT R;SCHWARZBAUER H et al.Diamond films as thermal conductors and electrical insulators applied to semiconductor power modules[J].Diamond and Related Materials,1994,3(4-6):658-662.
[15] DUFOUR B;MCNULTY M;MILLER S .Microwave multichip module utilizing aluminum silicon carbide with In-Situ cast components and high density interconnect technology[J].International Journal of Microcircuits and Electronic Packaging,1997,20:303-308.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%