欢迎登录材料期刊网

材料期刊网

高级检索

为了研究超声键合中在超声能量作用下金属间形成键合界面而构成键合力的机理,确定金属间吸收的超声能量与形成的界面质量的关系,在超声楔焊键合试验中,对Al-Ni楔焊通过改变焊接参数而获得完全键合和半键合的界面,并对其界面特征进行扫描电镜测试分析;同时,利用示波器采集超声键合机焊接时的电信号,分析了PZT驱动的输入阻抗和功率特性,并与界面质量对比.研究结果表明:超声键合而形成的Al-Ni界面为中央未键合的椭圆界面;相同参数条件下,一焊输入阻抗和吸收功率大于二焊,一焊的界面质量也高于二焊.

参考文献

[1] JIROMARU Tsujino;HIROYUKI Yoshihara;KAZUYOSHI Kamimoto et al.Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding[J].Ultrasonics,2002,36(02):59-65.
[2] HARMAN G G.Wire Bonding in Microelectronics[M].McGraw-Hill Publisher,1997
[3] HARMAN G G.Wire bonding to advanced copper,lowk integrated circuits,the metal/dielectric stacks,and materials considerations[J].IEEE Transactions on Parts,Hybrids,and Packaging,1990(13):176-181.
[4] SHIVESH Suman;MICHAEL Gaitan;YOGENDRA Joshi.Wire Bond Temperature Sensor Georgia Institute of Technology[M].IEEE,2002
[5] JURG Schwizer;MICHAEL Mayer;DANIEL Bolliger.Thermosonic ball bonding:friction model based on integrated microsensor measurements[A].Texas,1999:108-114.
[6] IVY Wei Qin;PAUL Bereznycky;DAVE Doerr .Wedge bonding for ultra fine pitch applications[J].Kulicke and Sofia,2003,1(02):A1-A10.
[7] PETER Elenius;LEE Levine.Comparingflip-chip and wire-bond interconnection technologies[J].Chip Scale Review,2000(08):81-87.
[8] KANG S Y;WILLIAMS P M;MCLAREN T S.Studies of thermosonic bonding for flip-chip assembly[J].Materials Chemistry and Physics,1995(42):31-37.
[9] WANG Changhai;REW Sholmes .Laser-assisted bumping for flip chip assembly[J].IEEE Transactions on Electronics Packaging Manufacturing,2001,24(02):109-114.
[10] V. Snitka;A. Ulcinas;M. Rackaitis;V. Mizariene .Ultrasonic surface vibration investigation by atomic force microscopy[J].Ultrasonics,1998(1/5):499-503.
[11] GAO Weilou;BERNHARD R Tittmann;CHIAKI Miyasaka.Contrast mechanism of ultrasonic atomic force microscopy[A].,1999
[12] JAMES E Krzazowski .A Transmission electron microscopy study of ultrasonic wire bonding[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1995,13(01):176-182.
[13] TAN Cher Ming;GAN Zhenghao .Failure mechanisms of aluminum bond pad peeling during thermosonic bonding[J].IEEE Transactions on Device and Materials Reliability,2003,3(02):44-50.
[14] QI Quan;GILES J Brereton .Mechanism of removal of micron-sized particles by high-frequency ultrasonic waves[J].IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control,1995,42(04):619-629.
[15] 姜庆滨,王晓林,闫久春.热塑性树脂基复合材料焊接研究[J].材料科学与工艺,2005(03):247-250.
[16] 董震;阎久春;杨士勤 等.超声波塑料焊接过程声学系统电参数的检测[J].哈尔滨工业大学学报,31(06):5-8.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%