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为了考察Sn-9Zn无铅焊料合金凝固组织及其在时效中的演变,制备了不同冷却条件及不同熔体过热度下Sn-9Zn/Cu焊点,并利用扫描电镜和光学显微镜观察了其组织形貌.观察发现:共晶组织随冷却速率提高而显著细化;同时,随炉缓冷凝固时合金形成完全的层片状共晶组织,而空冷和喷水冷却条件下合金除层片状共晶组织外,还形成了杆状富锌相.实验结果还表明,熔体过热度对出炉空冷合金的共晶组织有显著影响,较高的熔体过热度使共晶组织更细密.在空冷合金的时效过程中,杆状富锌相趋于逐渐溶解消失,90℃时效时还发生了共晶组织的显著粗化.

参考文献

[1] ABTEW M;SELVADURAY G .Lead-free solders in microelectronics[J].Materials Science and Engineering,2000,27:95-141.
[2] Suganuma K.;Shoutoku T.;Nakamura Y.;Niihara K. .Wetting and interface microstructure between Sn-Zn binary alloys and Cu[J].Journal of Materials Research,1998(10):2859-2865.
[3] 黄惠珍,魏秀琴,周浪.无铅焊料及其可靠性的研究进展[J].电子元件与材料,2003(04):39-42.
[4] KIM Y S;KIM K S;HWANG C W et al.Effect of composition and cooling rate on mierostructure and tensile properties of Sn-Zn-Bi alloys[J].Journal of Alloys and Compounds,2003,352:237-245.
[5] SUGANUMA K;MURATA T;NOGUCHI H et al.Heat resistance of Sn-9Zn solder/Cu interface with or without coating[J].Journal of Materials Research,2000,15(04):884-891.
[6] C.M.L.Wu;C.M.T.Law;D.Q.Yu;L.Wang .The Wettability and Microstructure of Sn-Zn-RE Alloys[J].Journal of Electronic Materials,2003(2):63-69.
[7] SONG J M;LAN G F;LUI T S et al.Mierostructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys[J].Scripta Materialia,2003,48:1047-1051.
[8] Chang TC.;Wang MC.;Hon MH. .Effect of aging on the growth of intermetallic compounds at the interface of Sn-9Zn-xAg/Cu substrates[J].Journal of Crystal Growth,2003(1/2):236-243.
[9] Yu SP.;Wang HC.;Wang MC.;Hon MH. .Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate[J].Journal of Materials Science,2002(1):185-190.
[10] 黄明亮,王来,王富岗.机械合金化无铅钎料Sn-9Zn研究[J].大连理工大学学报,2001(06):686-690.
[11] 魏秀琴,黄惠珍,周浪.微合金化对Sn-9Zn基无铅钎料润湿性能的影响[J].电子元件与材料,2003(11):38-39,42.
[12] SUGANUMA K .Current lead-free soldering in Japan[EB/OL].http://www.nepss.org/presentations/SEMI_ Europe/leadfreesolderingjapan.pdf,2004-12-11.
[13] 王家忻;黄松荣;林建生.金属的凝固及其控制[M].北京:机械工业出版社,1983
[14] 殷凤仕,孙晓峰,李耀彪,于洋,郑启,管恒荣,胡壮麒.熔体过热处理对M963合金组织和高温持久性能的影响[J].金属学报,2003(01):75-78.
[15] 陈忠伟,介万奇.熔体过热对Al-7%Si-0.50%Mg合金的显微组织和力学性能的影响[J].铸造,2001(12):724-727.
[16] 边秀房;刘相法;马家骥.铸造金属遗传学[M].济南:山东科学技术出版社,1999
[17] BIAN X F;WANG W M .Thermal-rate treatment and structure transformation of Al-13 wt.% Si alloy melt[J].Materials Letters,2000,44:54-58.
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