Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制

航空材料学报, 2001, 21(1): 18-22. doi: 10.3969/j.issn.1005-5053.2001.01.005

Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制

邹贵生 ^1, , 吴爱萍 ^2, , 任家烈 ^3, , 李盛 ^4, , 任维佳 ^5,

1.清华大学机械系,

2.清华大学机械系,

3.清华大学机械系,

4.清华大学机械系,

5.清华大学机械系,

基金项目: 国家自然科学基金(596750056)

关键词： TLP扩散连接 , Si3N4陶瓷 , 高温强度

TLP diffusion bonding of Si3N4 ceramics using Ti/Ni/Ti multilayer and controlling of joints＇ quality

研究了Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷。结果表明，Ni-Ti过渡液相存在时间短，在此期间形成的界面结合强度低；必须进一步固态扩散反应才能形成高强度接头，相应的接头显微结构为：Si3N4/TiN/Ti5Si3+Ti5Si4+Ni3Si/NiTi/Ni3Ti/Ni。连接时间、连接温度、连接压力及Ti和Ni的厚度影响接头组织和强度，其最佳值为60min，1050℃、2.5MPa、20μm和400μm，所得接头室温和800℃剪切强度分别为142MPa和61MPa。

TLP diffusion bonding of Si3 N4 ceramics with Ti/Ni/Ti multilayer was investigated. The existing time of Ni-Ti transient liquid phase is short, and the strength of the interface formed within this duration is very low. The formation of strong joints needs further solid-state diffusion reaction, and its microstructures is Si3N4/TiN/TisSi3 + TisSi4 + Ni3Si/NiTi/Ni3Ti/Ni. The joints＇ strength is affected by bonding parameters, which include bonding time、bonding temperature、bonding presssure、thickness of Ti or Ni. The shear strength of joints at room temperature and 800℃ could reaches 142MPa and 61MPa, respectively.

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