Pd-Ni基高温钎料对Si3N4陶瓷的润湿与界面连接

航空材料学报, 2006, 26(5): 41-45. doi: 10.3969/j.issn.1005-5053.2006.05.010

Pd-Ni基高温钎料对Si3N4陶瓷的润湿与界面连接

陈波 ^1, , 熊华平 ^2, , 毛唯 ^3, , 程耀永 ^4, , 叶雷 ^5, , 吴欣 ^6, , 李晓红 ^7,

1.北京航空材料研究院,北京,100095

2.北京航空材料研究院,北京,100095

3.北京航空材料研究院,北京,100095

4.北京航空材料研究院,北京,100095

5.北京航空材料研究院,北京,100095

6.北京航空材料研究院,北京,100095

7.北京航空材料研究院,北京,100095

基金项目: 国家自然科学基金(59905022;50475160) 国防科技预研项目(51418050304HK5104)

关键词： Si3N4 , 反应层 , 润湿性 , 钎料

Wettability of Pd-Ni Based Brazing Fillers on Si3N4 Ceramic and Interfacial Bonding

采用座滴法研究了三种钎料Pd-Ni、PdNi-(5～14)Cr(wt%, 下同)和PdNi-(15～26)Cr在Si3N4陶瓷上的润湿情况.结果表明,在1250℃/30min的真空加热条件下,随着Cr元素的加入钎料润湿性逐渐改善.Pd-Ni钎料中未加入Cr的情况下,反应层中主要是Pd参与反应,生成相应的Pd-Si等相,Ni也参与反应生成Ni-Si等相;当钎料中加入活性元素Cr以后,反应层中主要为Cr参与反应,同时生成相应的Cr-N和Cr-Si等相,另外反应层中也有一部分Ni参与反应.在PdNi-(5～14)Cr/ Si3N4的界面反应层中出现了薄的黑色Cr-N层,对于Cr含量更高的PdNi-(15～26)Cr钎料,在靠近Si3N4的界面即形成Cr-N反应层.

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