分别采用热膨胀仪和激光脉冲导热仪测试2.5D C/SiC复合材料从室温到1400℃纵向、横向的热膨胀系数和厚度方向的热扩散系数.结果表明,2.5D C/SiC复合材料的热膨胀系数随温度的升高而缓慢升高,在350℃和700℃附近出现波动,且横向的热膨胀系数略高于纵向.热扩散系数随温度的升高逐渐降低,且下降速率随温度的升高而变缓.CVD SiC涂层后,材料热扩散系数提高1~2倍.
参考文献
[1] | BOITIER G;VICENS J;CHERMANT J L .Understanding the creep behavior of a 2.5D Cf-SiC composite Ⅰ:morphology and microstructure of the as-received material[J].Materials Science and Engineering,2000,A279:73-80. |
[2] | BOITIER G;CHERMANT J L;VICENS J .Understanding the creep behavior of a 2.5D Cf-SiC composite Ⅱ:experimental specifications and macroscopic mechanical creep responses[J].Materials Science and Engineering,2000,A289:265-275. |
[3] | BOITIER G;VICENS J;CHERMANT J L .Understanding the creep behavior of a 2.5D Cf-SiC composite Ⅲ:from mesoscale to nanoscale microstructural and morphological investigation towards creep mechanism[J].Materials Science and Engineering,2000,A313:53-63. |
[4] | DALMAZ A;DUCRET D;GUERJOUMA R El et al.Elastic moduli of a 2.5D Cf/SiC composite[J].Experimental and Theoretical Estimates Composites Science and Technology,2000,60:913-925. |
[5] | DALMAZ A;REYNAUD P;ROUBY D et al.Mechanical behavior and damage development during cyclic fatigue at high-temperature of a 2.5D carbon/SiC composite[J].Composites Science and Techonology,1998,58:693-699. |
[6] | QUEK M Y .Analysis of residual stresses in a single fibermatrix composite[J].International Journal of Adhesion and Adhesives,2004,24:379-388. |
[7] | G.M.Gladysz;K.K.Chawla .Coefficients of thermal expansion of some laminated ceramic composites[J].Composites, Part A. Applied science and manufacturing,2001(2):173-178. |
[8] | BOBET J L;LAMON J .Study of thermal residual stresses in ceramic matrix composites[J].Journal of Alloys and Compounds,1997,259:260-264. |
[9] | 杨彩云,刘雍,陈利,李嘉禄.结构参数对碳/树脂3D机织复合材料拉伸性能的影响[J].复合材料学报,2006(01):85-91. |
[10] | PARKER W J;JENKINS R J;BUTLER C P et al.Flash method of determining thermal diffusivity,heat capacity,and thermal conductivity[J].Journal of Alloys Physics,1961,32(09):1679-1684. |
[11] | 宁青菊;谈国强;史永胜.无机材料物理性能[M].北京:化学工业出版社,2006:109-126. |
[12] | LUO Rui-ying;LIU Tao;LI Jinsong et al.Thermalphysi cal properties of carbon/carbon composites and physical mechanism of thermal expansion and thermal conductivity\[J].CARBON,2004,42:2887-2895. |
[13] | CHENG Lai-fei;XU Yong-dong;ZHANG Qing .Thermal diffusivity of 3D C/SiC composites from room temperature to 1400℃[J].CARBON,2003,41:707-711. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%