采用充氢CT试样对TC4钛合金电子束焊接头的室温疲劳裂纹扩展速率进行了测定,并对试样断口和接头各区显微组织进行了观察.试验结果表明:充氢母材试样在低速扩展区和失稳扩展区的da/dN相对于未充氢试样有明显的提高,但不同氢含量之间差别不大,在稳态扩展区(Paris区),氢对da/dN的影响很小.充氢焊缝试样在整个裂纹扩展过程中的da/dN明显提高,且随着氢含量的增加而增加.断口分析结果表明氢的加入使得材料脆性增大,促进了裂纹的扩展.在Paris区,组织结构的转变对da/dN的影响显著,电子束焊接头焊缝的针状马氏体组织比层片状α+β组织具有更高的抵抗裂纹扩展的能力.
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