对比分析了Q235钢在无Fe2+的接菌培养基和Fe2浓度为30mg/L的接菌培养基中的腐蚀行为.使用光学显微镜跟踪观察Q235钢在两种介质中的表面形貌随时间的变化,用电化学阻抗谱研究Q235钢在两种培养基中的电化学行为.用聚焦离子束显微镜制作Q235钢在两种培养基中的腐蚀产物剖面,并用能谱对腐蚀产物进行成分分析.对电化学阻抗谱所得结果进行拟合,结果表明,Fe2会使Q235钢表面形成的生物膜电阻降低,电容升高,Q235钢反应电阻保持较低,从而使反应持续进行,铁不断溶解.培养基中加入30mg/L的Fe2+后,Q235钢表面附着的细菌显著增多,形成的生物膜厚而疏松,膜中混合有腐蚀产物硫化物,膜下的金属出现众多微小的点蚀.电化学阻抗谱拟合结果与形貌观察及成分分析结果吻合,Fe2+对Q235钢的SRB腐蚀反应具有催化作用.
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