通过室温拉伸和显微硬度,比较2219铝合金电子束焊接(EBW)、搅拌摩擦焊(FSW)和钨极氩弧焊(TIG)所获接头的力学性能,利用扫描电镜、光学显微镜等手段,比较三种接头力学性能差异,并探讨产生差异的原因.结果表明:EBW所获接头的室温抗拉强度达到母材的79％左右,焊缝处的显微硬度达到97HV; FSW所获接头的室温拉伸强度达到母材的74％左右,焊缝处的显微硬度达到97.6HV；TIG所获接头抗拉强度只有母材的53％,焊缝处的显微硬度为72HV.EBW和FSW所获接头的力学性能明显优于钨极氩弧焊接接头,运用扫描电镜和光学显微镜等手段,研究发现EBW和FSW所获接头焊缝区细小的等轴晶组织、Cu元素在焊缝中的分布均匀、高质量焊缝成形是接头具有良好性能的主要原因.
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