欢迎登录材料期刊网

材料期刊网

高级检索

针对如何改善粉末冶金钨铜系高比重合金的烧结性能,提高其致密度,获得特殊结构的微观组织等问题,就近年来钨铜复合材料研究的几个主要热点:纳米结构材料、梯度结构功能材料、金属注射成形等进行了综述.

参考文献

[1] David J W;Barabash V R;Makhankov A et al.Assessment of tungsten for use in the ITER plasma facing components[J].Journal of Nuclear Materials,1998,258-263:308.
[2] Jedamzik R;Neubrand A;Rodel J .Functionally graded materials by electrochemical processing and infiltration:application to tungsten/copper composies[J].Journal of Materials Science,2000,35:477.
[3] Gusmano G.;Polini R.;Magistris P.;Marcheselli G.;Bianco A. .Chemical synthesis and sintering behaviour of highly dispersed W/Cu composite powders[J].Journal of Materials Science,2001(4):901-907.
[4] 陈文革,丁秉均.钨铜基复合材料的研究及进展[J].粉末冶金工业,2001(03):45-50.
[5] 李云平,曲选辉,段柏华.W-Cu(Mo-Cu)复合材料的最新研究状况[J].硬质合金,2001(04):232-236.
[6] Kim B K;Choi C J .Fabrication of nanostructured powders by chemical processes[J].Scripta Materialia,2001,44:2161.
[7] Ryu S S;Kim Y D;Moon I H .Dilatometric analysis on the sintering behavior of nanocrystalline W-Cu prepared by mechanical alloying[J].Journal of Alloys and Compounds,2002,335:233.
[8] Lee J S;Kim T H .[J].Nanostructured Materials,1995,6:690.
[9] Yoon E S;Yu J H;Lee J S.Sintering behavior of the PIMed W-15wt% Cu nanocomposite powder[A].Granada,Spain,1998:57.
[10] Bose A .Powder injection molding of tungsten heavy alloys[J].Posder Metall,1997,40:177.
[11] B.Yaing .Powder Injection Molding and Infiltration Sintering of Superfine Grain W-Cu[J].International Journal of Powder Metallurgy,1997(4):55-62.
[12] Kim J C;Ryn S S;Lee H et al.Metal injection molding nanostructured W-Cu composite powder[J].International Journal of Powder Metallurgy,1999,35(04):47.
[13] Moon I H;Kang M K;Lee J S.Metal injection molding of the nanocomposite W-Cu powder[A].Paris,France,1994:1807.
[14] Sainz-Borda J M;Gutierrez I;Fernandez F C et al.[J].Powder Metallurgy,1995,38(01):31.
[15] 谢发勤;张军;毛协民 等.深过冷溶体激发快速定向凝固[J].材料科学与工艺,1996,4(03):102.
[16] 坚增运,严文.深过冷金属熔体中单晶形成的临界条件[J].自然科学进展,1999(02):165.
[17] Zhang J;Laird C .Cyclic hardening of tungsten monofilament-reinforced nanocrystalline copper matrix composites[J].Acta Materialia,1999,4(04):3811.
[18] 梁淑华,范志康,胡锐.电弧熔炼法制造CuCr系触头材料的组织与性能[J].特种铸造及有色合金,2000(04):25-26.
[19] 凤仪;许少凡;颜世钦 等.纤维强化金属基复合材料及其应用[J].机械工程材料,1995,19(01):9.
[20] LEE J S;Kim T H .Densification and microstructure of the nanocomposite W-Cu powers[J].Nanostructured Materials,1995,6:691.
[21] Ben J S .Dispersion strengthened superalloys by mechanical alloying[J].Metallurgical and Materials Transactions,1970,1(10):2946.
[22] Moon I H .[J].Proceedings of the 13th Inter Plansee Seminar,1993,1(01):451.
[23] Moon I H.[J].Proceedings of the 14th Inter Plansee Seminar,1997(01):16.
[24] Kim J C;Ryu S S;Moon I H .[J].Journal of Advanced Materials,1999,31:37.
[25] Kaysser W A;Ilschner B .[J].Materials Research Bulletin,1995,20(01):22.
[26] 周张健,葛昌纯,李江涛.热压法制备W/Cu功能梯度材料[J].材料科学与工艺,2000(01):52-54.
[27] Davis J W;Slattery K T;Drie Meyer D E.[J].Journal of Neul Mater,1996:233-238.
[28] Takahashi M;Itoh Y;Miyazaki M;et al edited by Bildstein H and Eck R.Proceedings of the 13th Inter Plansee Seminar[C].Metallwerk Plansee,Reutte,1993:17.
[29] 凌云汉,周张键,李江涛,杨大正,葛昌纯.超高压梯度烧结法制备W/Cu功能梯度材料[J].中国有色金属学报,2001(04):576-581.
[30] Jech D E;Sepulveda J L;Frazier J P;Swerden R H .Functionally graded metal substrate for use in housing a microelectronic component has a functional insert and a surrounding body in the x-y plane that is made from two metal compositions[P].US:6114048A,2000.
[31] Kuwabara M .Manufacture of inclination function material-involves baking compact formed from two ceramic-metal powder mixtures such that ceramic and metal from respective mixture diffuse to ceramic and metal side compositions respectively[P].US:6248290B1,2001.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%