以W28的工业磨料用碳化硅粉和W10的高纯石墨粉为原料,采用氧化结合法制备出孔隙含量分别为38%、48%和61%的SiC预成形坯.研究了SiC多孔陶瓷的低温氧化烧结机理和石墨添加量对SiC陶瓷骨架烧结密度和尺寸变化的影响.研究结果表明:在1100℃烧结时,碳化硅和石墨粉同时发生氧化反应,碳化硅粉体通过自身氧化产生SiO2而焊接在一起,形成陶瓷骨架;石墨氧化去除后形成孔隙;SiC粉体间的本征孔隙和石墨去除后留下的孔隙构成三维互连通状态;因SiC氧化导致陶瓷骨架产生3%左右的线膨胀,膨胀量随石墨含量的增加而增大.
参考文献
| [1] | Konopka K.;Olszowka-Myalska A.;Szafran M. .Ceramic-metal composites with an interpenetrating network[J].Materials Chemistry and Physics,2003(2/3):329-332. |
| [2] | 张强,陈国钦,武高辉,姜龙涛,栾伯峰.含高体积分数SiCp的铝基复合材料制备与性能[J].中国有色金属学报,2003(05):1180-1183. |
| [3] | Arpon R;Molina J M et al.Thermal expansion behaviour of aluminum/SiC composites with bimodal particle distributions[J].Acta Materialia,2003,51:3145. |
| [4] | Zweben C .Metal-matrix composites for electronic packaging[J].JOM-Journal of the Minerals Metals and Materials Society,1992,44:15. |
| [5] | 张韧,王子良,崔岩.无压浸渗SiC/A1的电镀和应用[J].电子与封装,2004(05):26-30. |
| [6] | Suraj Rawal .Metal-Matrix Composites for Space Applications[J].JOM,2001(4):14-17. |
| [7] | 黄强,金燕萍,顾明元.电子封装用金属基复合材料的制备[J].材料导报,2002(09):18-19,17. |
| [8] | 崔岩,陈续东.低膨胀、超高模量铝基复合材料及其无压浸渗制备加工技术[J].中国有色金属学报,2004(z3):33-36. |
| [9] | Rodriguez-reyes M;Pech-canul M et al.Effect of Mg loss on the kinetics of pressureless infiltration in the processing of Al-Si-Mg/SiC composites[J].Materials Letters,2003,57:2081. |
| [10] | Xi XM.;Yang XF. .SPONTANEOUS INFILTRATION OF ALUMINUM-SILICON ALLOY INTO SILICON CARBIDE PREFORMS IN AIR[J].Journal of the American Ceramic Society,1996(1):102-108. |
| [11] | Zulfia A.;Hand RJ. .The production of Al-Mg alloy/SiC metal matrix composites by pressureless infiltration[J].Journal of Materials Science,2002(5):955-961. |
| [12] | Pech-canul M;Katz R N;Makhlouf M M .Optimum conditions for pressureless infiltration of SiCp preforms by aluminum alloys[J].Journal of Materials Processing Technology,2000,108:68. |
| [13] | Chiou J M;Chung D D L .Improvement of the temperature resistance of aluminum-matrix composites using an acid phosphate binder:part Ⅰ binders[J].Journal of Materials Science,1993,28:1435. |
| [14] | Chiou J M;Chung D D L .Improvement of the temperature resistance of aluminum-matrix composites using an acid phosphate binder:part Ⅱ preforms[J].Journal of Materials Science,1993,28:1447. |
| [15] | Rantnaparkhi P L;Howe J M .Characterization of a diffusionbonded Al-Mg alloy/SiC interface by high resolution and analytical electron microscopy[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1994,25A(03):617. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%