研究了Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷时压力对接头形成的作用机制。结果表明，TLP来不及与陶瓷发生充分反应并形成高强度结合界面就已完全凝固，为形成高强度的结合界面，必须进一步发生固态扩散反应。只有当连接过程中施加足够的压力，才能保证TLP在其存在期间充分铺展陶瓷，并在TLP完全凝固后形成大量扩散通道，为固态扩散反应提供必要条件。
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