欢迎登录材料期刊网

材料期刊网

高级检索

论述了金属胶接接头内应力研究的新进展,提出基于粘弹性理论胶层固化内应力的计算方法和薄膜弯曲法测定内应力的方法,以及周期性温度变化会使胶层内产生残余拉伸应力(热应力),并且分析了气泡和填充物对热应力的影响.

参考文献

[1] Gent A N .Fracture mechanics of adhesive bonds[J].Rubber Chemistry and Technology,1974,47:202-212.
[2] Gent A N;Meinecke E A .Compression ,bending and shear of bonded rubber blocks[J].Polymer Engineering and Science,1970,10(01):48-53.
[3] Harrison N L .The Stresses in an adhesive layer[J].Journal of Adhesion,1972,3:195-212.
[4] 顾志芬 等.纤维铝合金胶接层板残余应力分布[J].复合材料学报,1995,12(01):75-80.
[5] Nakamura;Hirohumi;Sato;Chiaki .Internal stress induced during curing process of adhesively bonded parts of resin and metal[J].Zairyo/Journal of the Society of Materials Science,1997,46(07):820-825.
[6] 大崛雅司 等.Viscoelastic properties and internal stress of thermosetting resin in curing process[J].材料(日本),1994,43(01):18-22.
[7] Croll G S .Internal stress in a solvent-cast coating[J].Journal of Coatings Technology,1978,50(638):33-38.
[8] Chow T S;Liu C A .Strains induced upon drying thin films solvent-cast on flexible substrates[J].Journal of POLYMER SCIENCE PART B:POLYMER PHYSICS,1976,14:1311-1316.
[9] Jennings R M;Taylor J F .Determination of residual stress in coatings by a membrane deflection technique[J].Journal of Adhesion,1995,49:57-74.
[10] Hahn H T .Residual stress in the interfacial bond zone of curing adhesives by a sensitive strain measurement technique[J].Journal of Adhesion,1984,17:21-32.
[11] 郭源君 等.耐磨胶粘涂层固化残余应力的测试分析[J].摩擦学学报,1997,17(03):263-266.
[12] Kim P K;Xu Y Y;Chang C;Hsu S L .Spectroscopicmechanical analysis of stress distribution[J].Polymer,1986,27(10):1547-1552.
[13] Galiotis C .Interfacial studies on model composites by laser raman spectroecopy[J].Composites Science and Technology,1991,42(1-3):125-150.
[14] 杨玉昆.合成胶粘剂[M].北京:科学出版社,1983:38-45.
[15] 游敏,郑小玲,郑勇.金属胶接接头的内应力及其消除[J].中国胶粘剂,1996(03):26-28,42.
[16] Robert Humfeld JR;Dillard D A .Residual stress development in adhesive joints subjected to thermal cycling[J].Journal of Adhesion,1998,65:277-306.
[17] Weitsman Y .Residual ,Thermal stresses in a symmetric double-lap Joint[J].Journal of thermal stresses,1980,3:521-535.
[18] Ramani;Karthik;Wenping Zhao .Evolution of residual stresses in thermoplastic bonding to metals[J].International Journal of Adhesion and Adhesives,1997,17(04):353-357.
[19] Yuichi Nakano;Masahide Katsuo .Two-demensional thermal stress analysis in adhesive butt joints containing hole defects and rigid fillers in adhesive under non-uniform temperature field[J].Journal of Adhesion,1998,65:57-80.
[20] Nakagawa F;Nakano Y;Sawa T .Two-dimensional thermal stress analysis of butt adhesive joint having rigid fillers in the adhesive[J].JSME International Journal,1994,37:238-245.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%