采用金相显微镜、透射电镜观察了焊后不同时效状态下T-250马氏体时效钢电子束焊缝的微观组织,测试了不同时效状态下焊接接头的室温强度、夏比缺口冲击韧性、显微硬度,并用扫描电镜分析了拉伸断口形貌.结果表明:随时效温度的升高,焊缝区枝晶间逆转奥氏体析出量增加, 焊缝缺口冲击韧性增大,断口韧窝增大;但由于500℃×4 h时效处理后焊缝马氏体孪晶较多而使其拉伸强度和缺口冲击韧性降低.经480℃×4 h时效处理后,焊接接头强度具有最佳强韧性配合.
参考文献
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