合成了两种以苯乙炔基封端的聚酰亚胺树脂,并对其熔体黏度、热性能和力学性能进行了研究.结果表明,两种树脂在280℃/2 h的熔体黏度均小于1 Pa·s,并具有良好的熔体黏度稳定性,可以用RTM的方法加工成型.PI-1树脂的T_g和T_d~5分别是402和534℃,PI-2树脂的T_g和T_d~5分别是356和525℃.碳纤维增强的PI-1基复合材料在300℃下具有大于70%的性能保持率.
Two series of phenylethynyl end-capped polyimide ohgomers were synthesized and their thermal and theological and mechanical properties were characterized. The results show that two oligomers exhibit low complex melt viscosity (<1Pa·s) at 280℃/2 h and are stable at this temperature. These two oligomers can be processed by resin transfer molding techniques. T_g and T_d~5 of PI - 1 resins are 402℃ and 534℃ respectively, P1-2 resins are 356℃ and 525℃ respectively. The retention rates of properties of PI - 1 resin/carbon fabric composite are beyond 70% at 300℃.
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