研究了气瓶赤道焊缝区的结构优化设计和焊接工艺改进措施,焊缝区渐变补强设计提高了焊缝区的应变协调性,改进电子束与焊缝作用方式解决了内部飞溅问题,采用优化的电子束工艺参数进行焊接.结果表明:焊接接头质量达到了GJB1718A-2005<电子束焊接>标准Ⅰ级焊缝,焊缝及热影响区力学性能与母材相当,气瓶进行鉴定试验,性能指标满足设计要求.气瓶焊缝结构优化设计,降低了焊缝处应力水平,减少应力集中,通过改进焊接工艺提高了电子束焊缝质量.
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