分别采用二维六方孔结构SiO2(SBA-15)和蠕虫状孔结构SiO2 (MSU-J)与MMA原位聚合制备介孔SiO2/PMMA杂化材料.采用XRD、N2吸附-脱附、SEM、DSC和TGA等方法研究了材料的微观结构、力学性能、热性能和介电性能.结果表明:介孔SiO2对PMMA有增强增韧作用,同时也有利于杂化材料热性能和介电性能的提高.杂化材料的热稳定性和耐热性均高于PMMA,含4wt％的SBA-15/PMMA和7wt％的MSU-J/PMMA杂化材料的介电常数由2.91分别降至最低2.73和2.64.
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