采用化学镀银的方法,制备了银包覆的金刚石复合材料,并利用场发射扫描电子显微镜(FESEM)、X射线衍射仪(XRD)和拉曼(Raman)光谱对样品的形貌和微结构进行了表征.利用电泳沉积的方法,制备了均匀的金刚石/银复合材料薄膜,场发射测试结果表明,在22 V/μm的电场下,金刚石/银复合材料的发射电流密度可达23.7 μA/cm2;而在26 V/μm的电场下,高压金刚石薄膜的发射电流密度仅为0.2 μA/cm2.与高压金刚石薄膜的场发射结果相比,金刚石/银复合材料的场发射性能有明显的提高.银的存在使银与金刚石界面处形成电子发射区,在外加电场作用下,该区域电子优先隧穿表面势垒逸出到真空,形成场致电子发射.
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