采用反应磁控溅射法在不同工作气压(0.5～2.0 Pa)下沉积了一系列氮化铝(AIN)薄膜.研究发现,在保持其他工艺参数不变的条件下,工作气压对薄膜厚度的影响很小.场发射性能测试表明,在较低的工作气压(0.5 Pa和0.7 Pa)下制备的A1N薄膜具有一定的场发射性能.扫描电子显微镜(SEM)图像显示,在较高的工作气压(2.0 Pa)下制备的薄膜易产生空位及微空洞等缺陷,使薄膜致密性下降.电子在薄膜中的输运因受到缺陷的散射而不能隧穿表面势垒进行发射.研究表明,为获得具有良好场发射性能的A1N薄膜,若采用反应磁控溅射法,应选取较低的工作气压;同时,对于薄膜型阴极,具有紧密晶粒结构及较小缺陷的薄膜可能具有更优异的场发射性能.
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