研究了薄型扁平四面封装(TQFP)器件在再流焊工艺中的分层开裂过程和PECVDSiNx薄膜对器件防水性能的影响。实验发现，水汽含量是引起器件分层开裂的主要原因；银浆与塑封料，芯片衬垫与塑封料之间的结合面是TQFP器件的薄弱环节,分层现象是由这些部位产生和扩展的。PECVDSiNx薄膜能有效降低进入TQFP器件中的水汽含量，在一定程度上消除开裂和分层现象，并且薄膜越厚，防水效果越好，消除开裂和分层现象的作用也越明显。
The process of delamination and crack in TQFP during the reflow and the effect of PECVD SiNx thin films on moisture－ resistance properties of TQFP were studied. The experiments revealed that the content of moisture in TQFP is the main cause of delamination and crack, and the interface between silver paste and molding compound, die pad and molding compound are the weakest positions where delamination initiates and extends. PECVD SiNx thin films can decrease the moisture content of TQFP effectively, and prevent the delamination and crack to certain extent, and the thicker the films, the lower the moisture content.
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