封装所导致的残余应力是电子器件封装和组装重点关注的问题.利用硅压阻传感器,原位实时地记录了不同粘接剂在FR4有机层压板衬底上固化过程中芯片表面的应力变化和残余应力的分布状况.研究表明,使用热膨胀系数较小的有机粘接剂粘贴芯片时,可获得较低的残余应力和相对优越的应力分布.该方法可作为芯片直接粘接时选择有机粘接剂的参照.
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