实验研究了氢、氧复合注入对注氧隔离技术制备 SOI(Silicon On Insulator)材料埋层结构的影 响.用截面透射电子显微镜和二次离子质谱技术分析了退火前后材料的微结构变化.研究表明, 氢离子的注入有利于注氧隔离制备的 SOI材料埋层的增宽.进一步的结果表明,室温氢离子注入 导致的增宽效应比高温注入明显.
参考文献
[1] | Colinge J P.Silicon- on- insulator Technology: Material to VLSI[M].Boston: Kluwer Academic Publishers,1991 |
[2] | Chen J;Wang X;CHEN M et al.Formation of Silicon on Insulator by SIMOX with Water Plasma[J].Applied Physics Letters,2001,78:73. |
[3] | Chen Meng;Wang Xiang;CHEN Jing et al.Dose- energy match for the formation of high- integrity buried oxide layers in low- dose separation- by- implantation- of- oxygen materials[J].Applied Physics Letters,2002,80:880. |
[4] | Ogura Atsuhi;Ono H .Evaluation of buried oxide formation in low- dose SIMOX process[J].Applied Physics Letters,1999,74:2188. |
[5] | Griscom D L .Diffusion of radiolytic molecular hydrogen as a mechanism for the post- irradiation buildup of interface states in SiO2- on- Si structures[J].Journal of Applied Physics,1985,58:2524. |
[6] | Fink D;Krauser J;Nagengast D et al.Hydrogen implan- tation and diffusion in silicon and silicon dioxide[J].Journal of Applied Physiology,1985,A61:381. |
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