通过高真空直流磁控溅射的方法,在玻璃和硅上淀积了结构为Ta/NiFe/CoFe/Cu/CoFe/IrMn/Ta的IrMn顶钉扎自旋阀薄膜.通过结构的改善和工艺条件的优化,自旋阀的磁电阻率达到9.12%,矫顽力为1.04×(103/4π)A/m.研究了Ta缓冲层厚度(小于6nm)对晶格结构和自旋阀性能的影响.结果表明,Ta为3nm时自旋阀磁电阻率最大,而矫顽力随着Ta厚度增大而减小.利用CoFe/Cu/CoFe SAF结构替换掉与IrMn相邻的CoFe被钉扎层,使交换偏置场从原来没有SAF的180×(103/4π)A/m上升到600×(103/4π)A/m左右,且交换偏置场随着SAF结构中两层CoFe的厚度差减小而增大.研究了RIE对自旋阀性能的影响,发现2min的RIE能使矫顽力减小33%,而磁电阻率几乎不受影响.
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