运用Nd:YAG激光在功率300W、光束运动速度为0.05m/s、光束直径为700μm的条件下能得到键合强度平均为9.3MPa的硅/玻璃熔融键合效果.该键合方法能进行选择区域键合,完全避免了由于键合过程中电场给超薄敏感可动微结构带来的畸变甚至失效,为新型室温红外探测器的研制奠定了良好的工艺基础.
参考文献
[1] | Wallis G;Pomerantz D I .Field assisted glass/metal sealing[J].Applied Physical,1969,40:3946. |
[2] | Rogers T.;Kowal J. .SELECTION OF GLASS, ANODIC BONDING CONDITIONS AND MATERIAL COMPATIBILITY FOR SILICON-GLASS CAPACITIVE SENSORS[J].Sensors and Actuators, A. Physical,1995(1/3):113-120. |
[3] | Puers B;Peeters E;Bossche Van Den A et al.A capacitive pressure sensor with low impedance output and active suppression of parasitic etfects[J].Sensors and Actuators A:Physical,1990,21-23:108-114. |
[4] | Eniko T Enikov;James G Boyd .A thermodynamic Aeeld theory for anodic bonding of microelectro - mechanical systems (MEMS)[J].International Journal of Engineering Science,2000,38:135-158. |
[5] | Chauffleur X.;Pons P.;Blasquez G. .INFLUENCE OF THE BONDING CONDITIONS ON THE RESPONSE OF CAPACITIVE PRESSURE SENSORS[J].Sensors and Actuators, A. Physical,1995(1/3):121-124. |
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