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采用气态源分子束外延( GSMBE)技术,以四溴化碳( CBr4)作为碳杂质源,系统研究了 InP衬 底上碳掺杂 p型 InGaAs材料的外延生长及其特性,在 AsH3压力 5.33× 104Pa,生长温度 500℃条件 下获得了空穴浓度高达 1× 1020/cm3、室温迁移率为 45cm2/Vs的重碳掺杂 p型 In0.53Ga0.47As材料. 研究了 CBr4和 AsH3束流强度以及生长温度等生长条件对碳掺杂 InGaAs外延层组份、空穴浓度和 迁移率的影响,并对不同生长条件下的氢钝化效应进行了分析.

参考文献

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