由于MEMS器件的可靠性成为MEMS产品商业化过程中一个重要问题,而冲击断裂是导致器件失效的一个重要原因.本文主要研究多晶硅微悬臂梁在冲击条件下的可靠性,文中阐述了断裂失效机理,并使用应力一强度模型对可靠度进行建模.通过实验统计在各种加速度冲击下的可靠度,并将实验实测值与理论值进行对比.
参考文献
[1] | U. Wagner;J. Franz;M. Schweiker .Mechanical reliability of MEMS-structures under shock load[J].Microelectronics and reliability,2001(9-10):1657-1662. |
[2] | Danelle M Tanner;Jeremy A Walraven;Karen Helgesen.MEMS reliability in shock environments[A].San Jose,California,U.S.A,2000:139-145. |
[3] | Victor S;Alastair T.MEMS failure analysis and reliability[A].,2003:17-22. |
[4] | Jiang Lili;Tang Jieying.Strength Reliability for Surfaces Micro-machined Polycrystalline Silicon Micro-cantilevers[A].:617-620. |
[5] | U Wagner;Muller-Fiedier R;Bagdahn J.Mechanical reliability of epipoly MEMS structures under shock load[A].Boston,Massachusetts,2003:175-178. |
[6] | Michael S Baker;Kenneth R Pohl.High-G Testing of MEMS Mechanical Non-Volatile Memory and Silicon Re-Entry Switch[J].Sandia Report,2005 |
[7] | 刘延柱;陈文良;陈立群.振动力学[M].北京:高等教育出版社,2005:125-158. |
[8] | 姜理利 .多晶硅微悬臂梁断裂失效的可靠性模型建立[D].东南大学,2006. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%