设计了一套采用聚合物粘附剂(Epo-Tek301)键合的圆片级MEMS塑料(polymethyl methac- rylate)封装方法.塑料封装封盖采用热压成型,激光划片形成4寸圆片.封盖和衬底键合工艺的粘附剂优化厚度为12μm,键合过程中不需要加压加温.测试结果显示该工艺的键合强度(1.3～1.6Mpa)可以满足一般封装需要,而所带入的应力也很小.划片采用分开划片:封盖采用激光划片而硅衬底采用机械划片.该方法封装的微流体芯片已经顺利测试和应用.由于工艺简单,成本低廉,该技术除了用于MEMS封装应用,也可作为划片测试保护.
参考文献
| [1] | Frank Niklaus.Adhesive wafer bonding for microelectronics and microelectromechanical systems[M].Royal Institute of Technology,Stockholm,2002 |
| [2] | 美国Epoxy Technology公司样本[OL].http://www.epotek.com/SSCDocs/datasheets/301.PDF,2007-4-23. |
| [3] | Jae Wan Kwon;Hongyu Yu;Eun Sok Kim .Film Transfer and Bonding Techniques for Covering Single-Chip Ejector Array With Microchannels and Reservoirs[J].Journal of Microelectromechanical Systems: A Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems,2005(6):1399-1408. |
| [4] | Jeffrey D Zahn;Ajay A Deshmukh;Alexandros P Papava-siliou.An integrated microfluidic device for the con-tinuous sampling and analysis of biological fluids[A].,2001 |
| [5] | Y. C. Lee;Babak Amir Parviz;J. Albert Chiou;Shaochen Chen .Packaging for Microelectromechanical and Nanoelectromechanical Systems[J].IEEE transactions on advanced packaging,2003(3):217-226. |
| [6] | Yu-Chuan Su;Liwei Lin .Localized Bonding Processes for Assembly and Packaging of Polymeric MEMS[J].IEEE transactions on advanced packaging,2005(4):635-642. |
| [7] | Zimmerman M;Felton L;Lacsamana E.Next genera-tion low stress plastic cavity package for sensor applications[A].,2005:231-237. |
| [8] | Han A;Wang O;Mohanty S K.A multi-layer plastic packaging technology for miniaturized bio analysis systems containing integrated electrical and mechanical functionality[A].,2002:66-70. |
| [9] | Schafer J D;Nafe H;Aldinger F .Macro-and microstress anslysis in sol-gel derived Pb(ZrxTi1-x)O3 thin films[J].Journal of Applied Physics,1999,85(12):8023-8031. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%