对TiO2基气敏材料的能带结构及测试气体分子轨道能量进行理论计算,结合实验,对TiO2-SnO2复合材料气敏元件工作温度的影响机理进行理论研究.结果表明:掺杂使TiO2能带带隙中产生掺杂能带,导带产生负移,有利于电子热激发.对比未掺杂TiO2气敏元件,在工作温度为260℃时,掺杂使TiO2元件电阻值由44.5Mù下降到22.5Mù.气体分子LUMO能级降低,有利于降低气敏反应的活化能,从而降低气敏元件的工作温度及提高灵敏度.
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