采用热丝化学气相沉积法(HWCVD),在金属铜诱导层上成功制备出横向晶粒尺寸在1μm左右、垂直晶粒尺寸达20μm的柱状多晶硅薄膜,其晶化率在95%以上.使用XRD、Raman光谱、扫描电子显微镜(SEM)等分析测试手段研究了灯丝温度在1500～1800℃之间变化时,金属铜诱导层对多晶硅薄膜的微观形貌、结晶性及晶体学生长方向的影响规律.结果表明:金属铜诱导层的引入,在一定温度范围内改善了晶粒尺寸,改变了多晶硅薄膜的择优取向,降低了薄膜的晶化温度,提高了晶化率.
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