通过DSC、XRD、SEM、EDS等测试手段,研究了钙铝硼硅/氧化铝系玻璃-陶瓷一个典型组成的致密化过程,并讨论了在这过程中物相、微观结构以及介电性能的变化规律.研究结果表明:在800～900℃烧成范围内,材料先致密化后析晶;825℃时,材料已烧结致密化,介电常数达到其最大值;850℃时,玻璃中析出钙长石晶体,介电损耗大幅下降;随着温度的进一步提高,材料结构变得松散,介电损耗略有增大.1MHz下,850℃所烧试样介电常数为7.9,介电损耗小于1×10-3,是一种性能优良的LTCC材料.
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