聚二甲基硅氧烷(PDMS)的表面改性与键合是微流控芯片制作中的关键技术之一.本文比较分析了PDMS常用表面改性方法的优缺点,利用电晕放电仪在常温环境下产生的氧等离子体实现了对PDMS表面改性及不可逆键合,优化了电晕放电仪的表面处理参数,重点测试了PDMS分别与PDMS和PMMA之间的键合强度.并与紫外照射、表面活化剂等表面改性方法得到的键合进行了强度比较.键合强度测试结果表明:常温下氧等离子体表面改性效果略逊于真空环境中的氧等离子体表面处理,但是其键合强度达到700KPa,高于其它表面改性方法的键合强度.
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