采用磁控溅射方法在Si(111)基底上沉积不同调制周期的Cu/TaN多层膜,用X射线衍射仪(XRD)与原子力显微镜(AFM)表征薄膜微结构与表面形貌,研究了不同调制周期L薄膜的微结构与表面形貌.结果表明:不同L的TaN调制层均为非晶结构,多晶Cu调制层的晶粒取向组成随着L改变而变化; Cu调制层的表面粗糙度Rrms.大于TaN调制层的Rrms;与Cu单层膜相比,最外层为Cu调制层的Cu/TaN多层膜的Rrms较小;与TaN单层膜相比,最外层为TaN调制层的Cu/TaN多层膜的/Rrms较大;随着L增加,多层膜与对应的单层膜之间的兄Rrms差值逐渐减小.
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