应用一套新的动力学蒙特卡洛方法模拟化学气相沉积生长Cu薄膜,铜原子随机生长在平方(100)同质晶格上.生长包括几个基本的过程:沉积,表面扩散,原子吸附,原子对成核,岛状生长等.薄膜的生长质量被诸如表面熵的一些参数所描述,表面熵是类比信息熵在通信领域的应用所提出的一个新的概念.发现低温和较低的覆盖层数往往伴随着粗糙的膜的表面,直到达到临界温度后不再变化,这些结论和实验的结果相一致.改变了传统的对薄膜粗糙度的定义,同时发现仅仅用粗糙度这个参数描述薄膜表面粗糙情况是不恰当的.最后对比结果解释了提出表面熵这个新概念的合理性.
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