对轧制复合的Ag/Cu双金属薄板采用不同温度的退火处理,研究了结合面分离强度随退火温度变化的规律,讨论了影响分离强度的因素.结果表明,在400℃以下随退火温度的升高,由于原子扩散及再结晶晶界的形成趋于充分而导致分离强度升高,400℃时分离强度达到最大值.当退火温度超过400℃后,由于结合面的异类原子不等量对流而导致结合面形成空洞,从而使分离强度下降.750℃退火时分离强度达到最低值.退火温度进一步上升到800℃时可使结合面发生局部熔合,使分离强度又有小幅度回升.
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