欢迎登录材料期刊网

材料期刊网

高级检索

利用电阻测量仪,电液伺服万能试验机(MTS),扫描电镜(SEM)和透射电镜(TEM)研究了添加微量Zr,Mg元素及Fe含量对室温和退火状态的形变Cu-Fe原位复合材料的组织、导电性和强度的影响.结果表明,添加Zr后,在不明显损失导电性的情况下,可使极限抗拉强度(UTS)提高约10%.进行2h不同温度退火处理,材料的电阻率在400℃之前稍稍减小,后快速增加;UTS在150℃之前稍稍增加,后快速减小,Zr的加入改善了材料的热稳定性,表现在随着退火温度的增加,UTS下降的幅度变缓.添加Mg使材料变脆.形变量和Fe含量的增加使材料的电阻率和强度显著增大.经150℃×2h,300℃×2 h退火处理可改善此类材料的综合性能.

参考文献

[1] HodgeW;Jaffee R I;Dunleavy J G et al.Strength and conductivity of Cu-Fe alloys[J].Transactions of the Metallurgical Society of AIME,1949,180:15-24.
[2] BevkJ;Harbison J P;Bell J L .Anomalous increase in strength of in situ formed Cu-Nb multifilamentary composites[J].Journal of Applied Physics,1978,49:6031-6038.
[3] VerhoevenJD;Chuen S C;Gibson E D .Strength and conductivity of in situ Cu-Fe alloys[J].Journal of Materials Science,1989,24:1748-1752.
[4] S.I.HONG;J.S.SONG .Strength and Conductivity of Cu-9Fe-1.2X (X = Ag or Cr) Filamentary Microcomposite Wires[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2001(4):985-991.
[5] J.S.Song;S.I.Hong;H.S.Kim .Heavily drawn Cu-Fe-Ag and Cu-Fe-Cr microcomposites[J].Journal of Materials Processing Technology,2001(1/3):610-616.
[6] HongSI;Song J S;Kim H S .Thermo-mechanical procesing and properties of Cu-9Fe-1.2Co microcomposite wires[J].Scripta Materialia,2001,45(11):1295-1300.
[7] PourrahimiS;Nayeb-hashemi H;Foner S .Strength and microstructure of powder metallurgy processed restacked Cu-Nb microcomposites[J].Metallurgical and Materials Transactions,1992,2:573-586.
[8] BoltaxA .Precipitation processes in Copper-rich Copper-iron alloys[J].Transactions of the Metallurgical Society of AIME,1960,218:812-821.
[9] PeltonAR;Laabs F C;Spitzig W A et al.Microstructural analysis of in-situ Cu-Nb composite wires[J].ULTRAMICROSCOPY,1987,22:251-265.
[10] JermanGA;Anderson I E;VerhoevenJ D .Strength and electrical conductivity of deformation-processed Cu-15 vol pct Fe alloys produced by powder metallurgy techniques[J].Metallurgical and Materials Transactions,1993,A24:35-42.
[11] VerhoevenJD;Downing H L;Chumbley L S et al.The resistivity and microstructure of heavily drawn Cu-Nb alloys[J].Journal of Applied Physics,1989,65:1293-1301.
[12] BoltaxA .Effect of cold work on copper-rich copper-iron alloys[J].Transactions of the Metallurgical Society of AIME,1962,224:281-287.
[13] MalzahnKampeJC;Courtney T H .Elevated temperature microstructural stability of heavily cold-worded in situ composites[J].Scripta Materialia,1986,20:285-289.
[14] E.N. Popova;V.V. Popov;L.A. Rodionova .Effect of annealing and doping with Zr on the structure and properties of in situ Cu-Nb composite wire[J].Scripta materialia,2002(3):193-198.
[15] S.I. Hong;M.A. Hill .MICROSTRUCTURE AND CONDUCTIVITY OF Cu-Nb MICROCOMPOSITES FABRICATED BY THE BUNDLING AND DRAWING PROCESS[J].Scripta materialia,2001(10):2509-2515.
[16] Sun Ig Hong;Mary Ann Hill .Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2000(1/2):189-197.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%