研究了Sn-3Ag/Cu钎焊接头在液相钎焊和固相时效后界面金属间化合物(IMC)的生长行为和晶体取向.实验结果表明,液相反应和固相反应生成的IMC形貌差别很大;液相钎焊时IMC生长与时间的0.4次方成正比,而在固相时效时IMC生长与时间的平方根成正比,其生长激活能为90kJ/mol;通过液固晶体取向对比,发现液态钎焊和固相时效中晶体取向没有明显变化.
参考文献
| [1] | Abtew M.;Selvaduray G. .Lead-free solders in microelectronics [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2000(5/6):95-141. |
| [2] | K.S. Kim;S.H. Huh;K. Suganuma .Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu[J].Microelectronics and reliability,2003(2):259-267. |
| [3] | 赵杰,戚琳,王来,刘强,关建华.时效处理对Sn-Ag-Cu-Bi无铅钎料显微组织和力学性能的影响[J].中山大学学报(自然科学版),2003(z1):28-31. |
| [4] | Zhao J et al.Influence of Bi on microstructures evolution and mechanical properties in Sn-Ag-Cu solder[J].Journal of Alloys and Compounds,2004,375:196-201. |
| [5] | Ikuo Shohji;Tomohiro Yoshida;Takehiko Takahashi;Susumu Hioki .Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2004(1):50-55. |
| [6] | Lee Hwa-Teng;Chen Ming-Hung et al.Influence of interfacial intermetallic compound on fracture behavior of solder joints[J].Materials and Engineering A,2003,358:134-141. |
| [7] | Guo F.;Choi S.;Subramanian KN.;Bieler TR.;Lucas JP.;Achari A. Paruchuri M. .Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):190-199. |
| [8] | Bartels F;Morris J W et al.Intermetallic phase formation in thin solid-liquid diffusion couples[J].Journal of Electronic Materials,1994,23(08):787-790. |
| [9] | K. H. PRAKASH;T. SRITHARAN .INTERFACE REACTION BETWEEN COPPER AND MOLTEN TIN-LEAD SOLDERS[J].Acta materialia,2001(13):2481-2489. |
| [10] | He Min;Chen Zhong;Qi Guojun .Solid state interfcial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni-P under bump metallization[J].Acta Materialia,2004,52:2047-2056. |
| [11] | 于大全 .电子封装互连无铅钎料及其界面问题研究[D].大连理工大学,2004. |
| [12] | CHOI S.;BIELER T.R.;LUCAS J.P.;SUBRAMANIAN K.N. .Characterization of the Growth of Intermetalli Interfacial Layers of Sn-Ag and Sn-Pb Eutectic Solders and Their Composite Solders on Cu Substrate During Isothermal Long-Term Aging[J].Journal of Electronic Materials,1999(11):1209-1215. |
| [13] | Vianco P T;Ericjson J L;Hopkin P L .Solder state intermetallic compound growth bewteen copper and high temperature,tin-rich solders-part Ⅰ:experimental analysis[J].Journal of Electronic Materials,1994,23(08):721-727. |
| [14] | 段莉蕾 .无铅钎料接头界面化合物层生长及元素扩散行为[D].大连理工大学,2004. |
| [15] | WON KYOUNG CHOI;HYUCK MO LEE .Effect of Soldering and Aging Time on Interfacial Microstructure and Growth of Intermetallic Compounds between Sn-3.5Ag Solder Alloy and Cu Substrate[J].Journal of Electronic Materials,2000(10):1207-1213. |
| [16] | Flanders D R;Jacobs E G;Pinzzotto R F .Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrate[J].Journal of Electronic Materials,1994,23(07):583-594. |
| [17] | D. Ma;W. D. Wang;S. K. Lahiri .Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow[J].Journal of Applied Physics,2002(5):3312-3317. |
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