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利用机械合金化和放电等离子烧结技术制备C/Cu复合材料,用扫描电镜、透射电镜、X射线衍射仪、显微硬度计和销-盘摩擦磨损试验机对复合粉末和烧结体的组织结构、硬度、摩擦学行为进行了分析.结果表明:C/Cu复合粉末中Cu相粉末由纳米/亚微米复合颗粒组成,石墨主要以纳米层片状结构和非晶态存在,放电等离子体烧结体组织致密、细小且均匀,随着碳含量增加,烧结体的硬度与密度减小;C/Cu复合材料烧结样品在摩擦过程中形成润滑膜,表现出较低的摩擦系数和良好耐磨性,其磨损机制主要为氧化磨损、粘着磨损和剥层磨损.

参考文献

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