在26篇文献的基础上综述了改性双马来酰亚胺(BMI)树脂在印制电路板(PCB)中的应用.介绍了二元胺、烯丙基苯基化合物及氰酸酯对BMI进行改性的3种体系,优良的耐热性和粘结性好、低介电常数等,使改性双马来酰亚胺树脂在印制电路板中获得广泛应用.
参考文献
| [1] | 赵磊;秦华宇.氰酸酯树脂在高性能印刷电路板中的应用[J].绝缘材料通讯,1999(02):7-11. |
| [2] | 彭永利,黄志雄.双马来酰亚胺/环氧树脂的电性能研究[J].武汉化工学院学报,2001(03):43-45. |
| [3] | 顾媛娟 等.BMI的链延长和链延长 BMI[J].高分子材料,1996,3:39-45. |
| [4] | Hayashida Yasuyuki .Preparation of fiber-reinforced plastics[P].JP:0393873,1991-04-18. |
| [5] | 梁国正;顾媛娟.双马来酰亚胺树脂[M].北京:化学工业出版社,1997 |
| [6] | 刘继延,刘学清,蒋旭东.氨基二苯醚-双马来酰亚胺共聚树脂及其玻璃布层压板的研究[J].绝缘材料,2001(02):10-12. |
| [7] | HASHIMOTO Takeshi .Materials for printed circuit boards having layers of siloxane-modified polyimide-containing thermosetting resin compositions with low dielectric con-stant[P].JP:2000204247,2000-7-25. |
| [8] | Yonemoto Kamio .Polyaminobismaleimide resin compositions[P].JP:07179756,1995-07-18. |
| [9] | Kankojiro .Imide prepolymers and cured products thereof[P].EP:424135,1991-04-24. |
| [10] | Tobisawaakihiko .Flame-retardant resin composition[P].JP:10273520,1998-10-13. |
| [11] | 刘润山,李友清,汪小华.含聚氨基双马来酰亚胺耐热固化剂的环氧-亚胺胶液[J].热固性树脂,2003(05):13-15. |
| [12] | 严小雄,王金龙,李小兰.改性聚酰亚胺封装基板的研制[J].绝缘材料,2003(05):20-22. |
| [13] | SakaiHiroshi;Iijima Toshiyuki .Nonhalogen-based prepreg for printed wiring board and use thereof[P].JP:2002206055,2002-07-26. |
| [14] | 李玲,张广成,蓝立文.烯丙基化合物改性双马来酰亚胺树脂研究进展[J].华北工学院学报,2001(01):29-37. |
| [15] | Chin Benjamin.A novel polyimide resin wystem for high reliability circuit board application[J].SAMPE Electro Conf,1989:733-744. |
| [16] | 樊渝江;江露霞.新型双马型聚酰亚胺共聚树脂及其玻璃布层压板[J].绝缘材料通讯,1993(01):7-10. |
| [17] | Olson Larry D;Kamla Jeffreyr .Polyimide resin laminates[P].US 5004775,1991-04-02. |
| [18] | Camberlin Yves .Novel imido copolymers[P].US 5034503,1991-07-23. |
| [19] | Yoshioka Shingo .Polyimide compositions for fire-resis- tant and teat-resistant printed circuit boards[P].JP:0422286,1992-08-12. |
| [20] | 赵磊,梁国正,孟季茹.双马来酰亚胺/溴化环氧树脂基覆铜箔板的研制[J].绝缘材料,2002(01):5-8. |
| [21] | 潘玉良,项小宇,袁漪.高频线路板基板-三嗪覆铜板[J].热固性树脂,1998(01):32. |
| [22] | Gotro Teffrey T .Characterization of a bismaleimide-tri- azine resin for multilayer printed circuit boards[J].IBM JOURNAL OF RESEARCH AND DEVELOPMENT,1988,32(05):616-625. |
| [23] | Hirata Akihiro .Modified maleimide resin varnishes as im- pregnating materials[P].JP 01172468,1989-07-07. |
| [24] | Japp Robert .Halogen-free fire-resistant dielectric resin mixtures,their prepregs and circuit boards and their man- ufacture[P].US 20033305,2003-01-02. |
| [25] | 祝大同.PCB基板材料用BT树脂[J].热固性树脂,2001(03):38-43. |
| [26] | 辜信实.印制电路用覆铜箔层压板[M].北京:化学工业出版社,2001 |
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