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综述了导电胶粘剂的分类、导电机理及导电胶粘剂的组成,指出导电胶粘剂的研究正向高导电率、低热阻、更可靠性的多功能化方向发展,并预期导电胶粘剂的应用前景是广阔的.

参考文献

[1] 陈党辉,顾瑛,陈曦.国外微电子组装用导电胶的研究进展[J].电子元件与材料,2002(02):34-39.
[2] 何天白;胡汉杰.功能高分子与新技术[M].北京:化学工业出版社,2001:20-25.
[3] 鲜飞.导电胶粘剂的研究现状[J].粘接,2001(05):37-38.
[4] 于洁;袁明;王琛 等.各向异性导电胶粘剂及其制备方法[P].CN 1280156A,2000-07-11.
[5] 朱毅 .导电胶粘剂[J].粘接,1999,26(1-2):1-6.
[6] 傅杰;王钧;胡琪.导电高分子材料及其应用前景[J].适用技术市场,1998(01):26-27.
[7] 陈燕丹,章文贡.导电聚合物纳米材料的研究进展[J].材料导报,2001(10):50-52,64.
[8] 马天信 .导电胶粘剂的性能及在电磁屏蔽方舱上的应用[J].方舱与电器设备,2003,2:22-33.
[9] 虞苏玮;安维丹 .高性能非银导电胶粘剂研究及应用[J].电子工艺技术,1997,18(01):34-39.
[10] 许佩新;陈治中;谢文明 .铜导电胶电性能的研究[J].材料科学与工程,1998,16:75-77.
[11] Lilei Ye;Zonghe Lai;Johan Liu;Anders Tholen .Effect of Ag Particle Size on Electrical Conductivity of Isotropically Conductive Adhesives[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,1999(4):299-302.
[12] LI Li;James E;Morris .Electrical conduction models for sotropically conductive adhesive joints[J].IEEE Transactions on Components Packaging and Manufacturing Technology Part A,1997,20:3-8.
[13] Ruschau G R;Yoshikawa S;Newnham R E.Resistivities of conductive composites[J].Journal of Applied Physics,1992(03):953-959.
[14] Daoqiang Lu;Quinn K. Tong;C. P. Wong .Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA's)[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,1999(3):223-227.
[15] 倪晓军,梁彤翔.导电胶的研究进展[J].电子元件与材料,2002(01):1-3,7.
[16] 傅振晓,张其土,凌志达.新型导电胶的研究与应用[J].江苏陶瓷,2001(02):16-17.
[17] King H A.Polymer based solder alternatives[A].,1988:46-49.
[18] Bueche F .Electrical resistively of conducting particles in an insulating matrix[J].Journal of Applied Physics,1972,43(11):4837-4852.
[19] Shaul M .Electrical resistively of a composite of conducting particles in an insulating matrix[J].Journal of Applied Physics,1972,43(05):2463-2483.
[20] Daoqiang Lu;Wong David;Wong C P .Properties of conductive adhesives based on different curing agents[J].Journal of Electronics Manufacturing,1999,9:241-249.
[21] 陈治中;许佩新;谢文明 .铜导电胶老化性能的研究[J].材料科学与工程,1998,16:59-80.
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