欢迎登录材料期刊网

材料期刊网

高级检索

以热固性丙烯酸酯树脂为基体,选用表面经特殊处理的镍粉制备了镍粉导电胶粘剂,研究了镍粉含量、固化时间、固化温度对导电胶的导电性能和剥离的影响,结果表明:导电胶粘剂的体积电阻率<0.10Ω·cm,导电胶"渗滤阈值"为镍粉含量38%~40%.

参考文献

[1] 乔庆东,王胜,王巍,雷良才.新型共混十二烷基苯磺酸掺杂的聚苯胺导电胶的合成[J].精细化工,1999(02):35-37.
[2] 鲜飞.导电胶粘剂的研究现状[J].粘接,2001(05):37-38.
[3] Lyons A.M.;Hall E. .A new approach to using anisotropically conductive adhesives for flip-chip assembly[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1996(1):5-11.
[4] Wong C P;Lu D.Development of Solder Replacement Isotropic Ally[A].Sheraton Towers,Singapore,2000:14-221.
[5] Liong S;Wong C P.An Alternative to Epoxy Resin for Application in Isotropically Dhesive[A].Braselton GA,2001:13-18.
[6] Li L.;Morris J.E. .Electrical conduction models for isotropically conductive adhesive joints[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1997(1):3-8.
[7] Chang D D;Crawford PA;Fulton J A et al.An Overview and Evaluationof Anisotropically Conductive Adhesive Film for Fine Pitch Electronic Assembly[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1993,16(08):28-835.
[8] Savolainen P;Kivilahti J.A Solder Alloy Filled Z-Axis Condutive Epoxy Adhesive[J].Journal of Adhesion,1995(49):87-196.
[9] 博杰;王钧;胡琪.导电高分子材料及其应用前景[J].适用技术市场,1998(01):26-27.
[10] 朱毅 .导电胶粘剂[J].粘接,1999,26(1-2):1-6.
[11] 黄世强;肖汉文;程时远.特种胶粘剂[M].北京:化学工业出版社,2002:146-147.
[12] 马天信 .导电胶粘剂的性能及在电磁屏蔽方舱的应用[J].方舱与地面设备,2003,2(02):22-24.
[13] 许佩新;陈治中;谢文明 等.铜粉导电胶粘剂的电性能的影响研究[J].材料科学与工程,1998,16(01):5-7.
[14] 何天白;胡汉杰.功能高分子与新技术[M].北京:化学工业出版社,2001:50-54.
[15] Fu Y;Liu J;Willander M.Conduction Modeling of a Conductive Adhesive wth Bimodal Distribution of Conducting Element[J].International Journal of Adhesion and Adhesives,1999(19):281-290.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%