以热固性丙烯酸酯树脂为基体,选用表面经特殊处理的镍粉制备了镍粉导电胶粘剂,研究了镍粉含量、固化时间、固化温度对导电胶的导电性能和剥离的影响,结果表明:导电胶粘剂的体积电阻率<0.10Ω·cm,导电胶"渗滤阈值"为镍粉含量38%~40%.
参考文献
[1] | 乔庆东,王胜,王巍,雷良才.新型共混十二烷基苯磺酸掺杂的聚苯胺导电胶的合成[J].精细化工,1999(02):35-37. |
[2] | 鲜飞.导电胶粘剂的研究现状[J].粘接,2001(05):37-38. |
[3] | Lyons A.M.;Hall E. .A new approach to using anisotropically conductive adhesives for flip-chip assembly[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1996(1):5-11. |
[4] | Wong C P;Lu D.Development of Solder Replacement Isotropic Ally[A].Sheraton Towers,Singapore,2000:14-221. |
[5] | Liong S;Wong C P.An Alternative to Epoxy Resin for Application in Isotropically Dhesive[A].Braselton GA,2001:13-18. |
[6] | Li L.;Morris J.E. .Electrical conduction models for isotropically conductive adhesive joints[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1997(1):3-8. |
[7] | Chang D D;Crawford PA;Fulton J A et al.An Overview and Evaluationof Anisotropically Conductive Adhesive Film for Fine Pitch Electronic Assembly[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1993,16(08):28-835. |
[8] | Savolainen P;Kivilahti J.A Solder Alloy Filled Z-Axis Condutive Epoxy Adhesive[J].Journal of Adhesion,1995(49):87-196. |
[9] | 博杰;王钧;胡琪.导电高分子材料及其应用前景[J].适用技术市场,1998(01):26-27. |
[10] | 朱毅 .导电胶粘剂[J].粘接,1999,26(1-2):1-6. |
[11] | 黄世强;肖汉文;程时远.特种胶粘剂[M].北京:化学工业出版社,2002:146-147. |
[12] | 马天信 .导电胶粘剂的性能及在电磁屏蔽方舱的应用[J].方舱与地面设备,2003,2(02):22-24. |
[13] | 许佩新;陈治中;谢文明 等.铜粉导电胶粘剂的电性能的影响研究[J].材料科学与工程,1998,16(01):5-7. |
[14] | 何天白;胡汉杰.功能高分子与新技术[M].北京:化学工业出版社,2001:50-54. |
[15] | Fu Y;Liu J;Willander M.Conduction Modeling of a Conductive Adhesive wth Bimodal Distribution of Conducting Element[J].International Journal of Adhesion and Adhesives,1999(19):281-290. |
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