综述了钛酸锶铅(PST)铁电薄膜目前最常用的4种制备工艺:溶胶-凝胶(Sol-gel)法、磁控溅射(Magnetron Sputtering)、脉冲激光沉积(PLD)和金属有机化学气相沉积(MOCVD),并简要介绍了PST目前的研究进展以及PST薄膜在铁电移相器、动态随机存储器(DRAM)和热释电红外探测器方面的应用,提出了发展展望.
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